The 3300 series is the fastest high resolution wafer inspection system available. With greater than 3x throughput and 2x pixel sensitivity improvements, the 3300 provides process and tool monitoring for the 45nm node and beyond. Its latest Step&Image acquisition system, now with eight pixel sizes, uniquely extends the 3300 production sensitivity for critical FEOL layers AND throughput of 40 WPH for high speed tool monitoring.
See improvements over 31/3200  »