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News & Events
Negevtech Extends Production Sensitivity For Memory Wafer Inspection
With The Release of 3200
Santa Clara, California, March 30, 2007 -Negevtech, Inc. today released its 3200 high-resolution wafer defect inspection system. Combining an enhanced version of Negevtech's proven and patented Step&ImageTM technology with its new IPχ image processing platform, the 3200 extends production flexibility and sensitivity into more applications in the front-end of line (FEOL) and back-end of line (BEOL) of memory wafer inspection applications.
"The new imaging modes of Step&Image II showed significant detection benefits to our beta site customers, especially on grainy BEOL metal layers," said Glyn Davies, Corporate VP of Marketing and President of U.S. operations for Negevtech. "And our IPχ platform is enabling detection improvements in difficult periphery and stitch-line regions." Davies added, "The improvement in overall sensitivity is enabling our customers to migrate applications to faster recipes and thereby reduce their inspection costs dramatically."
The 3200 is currently proving its value at multiple leading edge memory fabs and is available for demonstrations at Negevtech's Santa Clara demo facility. Negevtech is offering field upgrades from the 3100 product to the IPχ platform and to the full 3200.
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